SAE SSB1_002
Environmental Tests and Associated Failure Mechanisms
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Standard by SAE International, 2014-09-12
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About This Item
This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.
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Standard Details
- Publication Date: 2014-09-12
- Standard Status: latest
- Publisher: SAE International
- Document Type: Aerospace Standard
- Subject: Joining, Failure modes and effects analysis, Humidity, Environmental testing, Pressure, Physical examination, Integrated circuits, Logistics, Packaging
- Official SAE: Doi link
Document History
- This Version: SSB1_002 (2014-09-12)
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