IEC 60068-2-69:2017/COR1:2018 provides a corrigendum linked to the test method for solderability testing of electronic components and printed boards by the wetting balance, based on the official title “Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)”. It is relevant for teams that rely on accurate test documentation, technical review, and conformity assessment when evaluating solderability performance. IEC 60068-2-69:2017/COR1:2018 should be used as a supporting reference to the parent document in engineering and compliance workflows.

Overview of IEC 60068-2-69:2017/COR1:2018

This corrigendum is associated with IEC 60068-2-69:2017 and supports the environmental testing method for solderability assessment using wetting balance force measurement. In practice, it helps organizations maintain alignment between the published test method and the corrected technical text used in laboratory evaluation, procurement review, and quality workflows. Because it is a corrigendum rather than the base publication, it is best treated as a document that modifies or clarifies the parent reference rather than as a standalone testing standard.

Compliance applications of IEC 60068-2-69:2017/COR1:2018

Organizations involved in electronic component qualification, printed board verification, and incoming inspection may use IEC 60068-2-69:2017/COR1:2018 to support documented evaluation of solderability testing procedures. It is particularly relevant where wetting balance measurements are used to check process consistency, review test reporting, or prepare technical documentation for customer, supplier, or certification expectations. The corrigendum can also be useful during regulatory preparation and engineering documentation control when the corrected wording must be reflected in test plans, laboratory instructions, or compliance records.

Importance of compliance with IEC 60068-2-69:2017/COR1:2018

Using the corrigendum alongside the parent document helps reduce interpretation errors and improves consistency in testing workflows. For engineering and quality teams, that matters because solderability results may affect product evaluation, supplier approval, and risk management decisions tied to assembly reliability. It also supports clearer conformity assessment preparation by ensuring the laboratory references the corrected technical text. In procurement and technical validation activities, an up-to-date compliance reference can help avoid ambiguity when specifying testing requirements or reviewing evidence from external test providers.

• Corrective reference linked to the wetting balance solderability test method in IEC 60068-2-69:2017.
• Relevant for laboratories, engineering teams, and compliance reviewers handling solderability verification.
• Supports controlled test documentation, technical assessment, and quality assurance processes.
• Useful when aligning conformity assessment records with the corrected parent publication.