IEC 60191-1:2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
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Language: English
License Type: Single User
Updates: Not Included
About This Item
IEC 60191-1:2018 provides the general rules used to prepare outline drawings for discrete semiconductor devices, helping engineers and procurement teams work from a consistent technical reference. By defining a common approach to mechanical standardization, it supports clearer component identification, comparison, and documentation across design and supply workflows. IEC 60191-1:2018 is especially relevant when outline drawings must be used for engineering review, technical validation, and conformity assessment of device form factors.
Purpose of IEC 60191-1:2018
The purpose of
IEC 60191-1:2018
is to establish a uniform basis for the preparation of outline drawings for discrete semiconductor devices. In practice, this helps align engineering documentation with expected mechanical presentation, reducing ambiguity during design review and product evaluation. It is typically used as a technical document that supports dimensional interpretation, drawing consistency, and controlled communication between device manufacturers, laboratories, and downstream users involved in compliance workflows.Compliance applications of IEC 60191-1:2018
This document is relevant in engineering and procurement processes where discrete semiconductor device outlines must be reviewed, specified, or compared against a defined reference format. It can support technical assessment, laboratory evaluation, and documented evaluation of package-related information during component selection or incoming verification. Organizations may use it to improve operational consistency in quality workflows, especially when preparing technical files, product documentation, or conformity assessment records.
Benefits of IEC 60191-1:2018
Using a consistent mechanical drawing framework can reduce risk in specification handoffs and help prevent errors during design integration or purchasing. The document supports testing workflows and engineering validation by giving teams a common basis for comparing device outlines and documenting assumptions. It may also improve compliance preparation by strengthening traceability, simplifying technical review, and helping align product data with procurement and quality assurance requirements.
- General rules for preparing outline drawings of discrete semiconductor devices
- Supports consistent mechanical standardization and document control
- Useful for engineering review, product evaluation, and supplier communication
- Helps prepare technical records for compliance and conformity assessment
- Publication Date: 2018-01-23
- Standard Status: Original
- Publisher: IEC
- Edition: 3
- This Version: IEC 60191-1:2018 (2018-01-23)
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