IEC 60191-4:2013 defines a mechanical standardization framework for semiconductor device packages, focusing on coding systems and classification of package outlines. For engineering, procurement, and compliance teams, it provides a structured technical reference for identifying package form factors consistently across documentation and product evaluation. In practice, IEC 60191-4:2013 supports clearer communication between design, sourcing, testing, and quality functions when semiconductor packages must be specified, compared, or verified against an agreed outline classification.

What is IEC 60191-4:2013?

This document is part of the IEC 60191 series for mechanical standardization of semiconductor devices. Its purpose is to organize package outlines into a coding and classification system so that semiconductor device packages can be referenced in a consistent way during technical review and conformity assessment. That makes it useful for engineering documentation, part selection, and controlled comparison of package forms, especially where dimensional interpretation and package identification affect downstream validation or procurement decisions.

Applications of IEC 60191-4:2013

IEC 60191-4:2013 is relevant wherever semiconductor package outlines must be identified and managed with precision, such as component engineering, supplier qualification, library creation, and product evaluation. It may also support laboratory evaluation and internal verification activities when teams need a common reference for package form classification. Organizations involved in electronics manufacturing, design control, and technical documentation often use this type of reference to improve operational consistency across quality workflows and compliance workflows.

Why is IEC 60191-4:2013 important?

Clear package classification helps reduce misinterpretation during specification review, footprint alignment, and procurement checks. IEC 60191-4:2013 supports technical validation by giving teams a shared basis for identifying semiconductor package outlines, which can improve engineering coordination and reduce risk in documentation-driven decisions. It is also helpful during conformity assessment preparation, where consistent references strengthen traceability, quality assurance, and review of device selection against design and manufacturing requirements.

• Provides a structured coding system for semiconductor package outline identification
• Supports engineering documentation and package comparison during design review
• Helps align procurement, supplier data, and part selection processes
• Assists verification activities and conformity assessment preparation
• Promotes consistent technical communication across quality and compliance workflows