IEC 60191-6-17:2011

IEC 60191-6-17:2011 defines mechanical standardization guidance for semiconductor device package outline drawings, with a specific focus on stacked packages using fine-pitch ball grid array and fine-pitch land grid array formats. For engineering teams, procurement specialists, and compliance reviewers, it provides a structured technical reference for documenting package geometry in a way that supports consistent interpretation across design, sourcing, and verification activities. IEC 60191-6-17:2011 is relevant where accurate package outline data is needed to reduce ambiguity in product evaluation and technical documentation.

Purpose of IEC 60191-6-17:2011

The purpose of IEC 60191-6-17:2011 is to establish general rules for preparing outline drawings for stacked semiconductor packages, specifically P-PFBGA and P-PFLGA types. It helps align mechanical representation with engineering expectations so that package dimensions, mounting interfaces, and outline data can be reviewed consistently. In practice, this supports technical assessment, documented evaluation, and conformity assessment activities where package definition must be clear enough for design integration, supplier comparison, and downstream verification workflows.

Compliance applications of IEC 60191-6-17:2011

Organizations may use IEC 60191-6-17:2011 when reviewing semiconductor package documentation for product development, component qualification, or procurement approval. It is particularly useful in workflows that depend on reliable outline drawings for surface mounted packages, such as board-level integration, footprint confirmation, and engineering documentation control. The reference can also support laboratory evaluation and technical review when comparing supplier data or preparing compliance records for stacked package implementations. Its value lies in improving consistency across technical and quality workflows.

Benefits of IEC 60191-6-17:2011

Using IEC 60191-6-17:2011 can help reduce interpretation errors in mechanical package documentation and improve consistency across design and verification teams. That can support risk management, interoperability at the PCB/package interface, and better alignment between engineering specification and procurement review. For organizations performing conformity assessment preparation or technical validation, a standardized outline drawing approach can improve traceability, simplify comparison of supplier data, and strengthen quality assurance processes where precise package definition is important.

• Guidance for outline drawings of stacked semiconductor packages
• Focus on fine-pitch ball grid array and fine-pitch land grid array formats
• Supports mechanical documentation used in design and verification workflows
• Useful for supplier comparison, footprint review, and conformity assessment preparation