IEC 60191-6-5:2001

IEC 60191-6-5:2001 provides technical guidance for the mechanical standardization of semiconductor device package outline drawings, with a specific focus on the design guide for fine-pitch ball grid array (FBGA) packages. It is relevant when engineering teams, procurement specialists, and compliance reviewers need a consistent reference for package representation and documentation. By supporting clearer outline definitions, IEC 60191-6-5:2001 can help reduce ambiguity in technical review, product evaluation, and conformity assessment workflows for surface mounted semiconductor devices.

What is IEC 60191-6-5:2001?

This document addresses the preparation of outline drawings for surface mounted semiconductor device packages, specifically the FBGA package form. Its purpose is generally to improve consistency in package documentation so that device dimensions and drawing conventions can be interpreted more reliably across design, manufacturing, and verification activities. For engineering documentation and technical validation, it serves as a focused reference that supports operational consistency and more structured review of package-related requirements.

Applications of IEC 60191-6-5:2001

IEC 60191-6-5:2001 is typically used in semiconductor packaging work where FBGA device outlines must be documented for design coordination, supplier communication, or procurement review. It may also support laboratory evaluation, drawing checks, and quality workflows that depend on consistent package representation. In practice, it is useful for teams preparing engineering specifications, comparing component data, or aligning technical documentation during product development and regulatory preparation.

Why is IEC 60191-6-5:2001 important?

Accurate package outline documentation is important for reducing integration risk, improving interoperability at the board and component level, and supporting reliable technical assessment. IEC 60191-6-5:2001 helps create a common reference for FBGA package drawings, which can improve testing consistency, procurement decisions, and conformity assessment preparation. For organizations working through verification activities or quality assurance reviews, it provides a structured basis for comparing supplier data and maintaining documented evaluation practices.

• Mechanical standardization guidance for surface mounted semiconductor package outline drawings
• Design reference focused on fine-pitch ball grid array (FBGA) package documentation
• Useful for engineering review, supplier coordination, and component procurement workflows
• Supports consistent dimensional interpretation in technical validation and conformity assessment
• Helps reduce ambiguity in package-related quality and verification activities