IEC 60191-6-6:2001

IEC 60191-6-6:2001 is the technical reference for preparing outline drawings of surface mounted semiconductor device packages, with a specific design guide for fine pitch land grid array (FLGA) packages. It is relevant when engineering teams, procurement specialists, and compliance reviewers need a consistent package outline for documentation, footprint alignment, and product evaluation. By setting a common drawing approach, IEC 60191-6-6:2001 helps reduce ambiguity during technical review, verification activities, and conformity assessment preparation.

Overview of IEC 60191-6-6:2001

The document addresses general rules for outline drawings within semiconductor package standardization, focusing on FLGA package presentation and dimensional communication. In practice, it supports clearer engineering documentation by helping designers, manufacturers, and laboratories interpret package geometry in a consistent way. IEC 60191-6-6:2001 is therefore useful where package definition, assembly planning, and documented evaluation depend on a stable technical reference rather than vendor-specific drawing conventions.

Compliance applications of IEC 60191-6-6:2001

This reference is commonly used in workflows involving semiconductor package specification, PCB footprint planning, incoming technical assessment, and product qualification. It can support quality workflows where package outline data must be checked against procurement records, test fixtures, or assembly drawings. For organizations handling FLGA devices, IEC 60191-6-6:2001 provides a practical basis for operational consistency across engineering, laboratory evaluation, and regulatory preparation activities tied to component documentation.

Importance of compliance with IEC 60191-6-6:2001

Using IEC 60191-6-6:2001 helps reduce errors caused by inconsistent outline drawings, which can affect assembly fit, inspection results, and downstream validation. A shared drawing framework improves technical compliance, supports better procurement decisions, and makes conformity assessment preparation more efficient. It is especially valuable when multiple teams must rely on the same engineering specification for package definition, risk management, and repeatable testing workflows across the product lifecycle.

• General rules for outline drawings of surface mounted semiconductor device packages
• Design guidance specific to fine pitch land grid array package presentation
• Support for footprint alignment, package definition, and engineering documentation
• Useful reference for verification activities, product evaluation, and conformity assessment preparation