IEC 60317-2:2019/AMD1:2024
Amendment 1 - Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
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About This Item
IEC 60317-2:2019/AMD1:2024 is a focused amendment to the parent document IEC 60317-2:2019, addressing specifications for solderable polyurethane enamelled round copper wire, class 130, with a bonding layer. It is relevant when engineering teams, purchasing groups, and laboratories need to align product definition, verification activities, and documented evaluation around a specific winding wire construction. As a supporting modification reference rather than a standalone requirement set, it helps keep technical compliance and procurement records consistent with the updated IEC 60317-2 framework.
IEC 60317-2:2019/AMD1:2024 standard overview
This amendment is intended to update or refine the parent specification for a particular winding wire type used in electrical equipment and related manufacturing workflows. The title indicates a product definition centered on solderable polyurethane enamelled round copper wire with a bonding layer, which is typically important for winding applications where insulation, solderability, and controlled bonding behavior must be reviewed together. For technical review, testing workflows, and conformity assessment preparation, IEC 60317-2:2019/AMD1:2024 provides a traceable compliance reference linked directly to the original edition.
Applications of IEC 60317-2:2019/AMD1:2024
Organizations may use this amendment when specifying or checking winding wire for motors, transformers, coils, inductors, and similar electrical components where round copper wire performance is part of the engineering specification. It is also useful in laboratory evaluation, incoming inspection, supplier qualification, and product evaluation activities that depend on a clear parent-document relationship. In procurement and quality workflows, IEC 60317-2:2019/AMD1:2024 helps teams verify that the selected wire form is being assessed against the current technical document set before release, testing, or certification work proceeds.
Why IEC 60317-2:2019/AMD1:2024 matters
For compliance and quality assurance teams, an amendment like IEC 60317-2:2019/AMD1:2024 supports consistent technical validation by keeping the governing document set aligned with the latest update to the parent specification. That reduces the risk of using outdated acceptance criteria during testing, supplier review, or conformity assessment preparation. It also helps maintain operational consistency across engineering documentation, procurement records, and verification activities, especially where winding wire selection affects safety, interoperability, and long-term reliability in electrical assemblies.
- Supporting amendment linked to IEC 60317-2:2019 rather than a standalone product specification
- Covers solderable polyurethane enamelled round copper wire with a bonding layer
- Relevant to winding wire selection, technical validation, and laboratory evaluation
- Useful for procurement checks, supplier documentation, and conformity assessment workflows
- Helps maintain alignment between engineering documentation and updated compliance references
- Publication Date: 2024-06-13
- Standard Status: Amendment
- Publisher: IEC
- Edition: 5
- This Version: IEC 60317-2:2019 (2024-06-13)
- Previous Version: IEC 60317-2:2019 (2019-08-08)
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