IEC 60317-35:2013/AMD2:2024
Amendment 2 - Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
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About This Item
IEC 60317-35:2013/AMD2:2024 provides Amendment 2 to the technical requirements for solderable polyurethane enamelled round copper wire, class 155, with a bonding layer. It is relevant when engineers, laboratories, and procurement teams need a controlled reference for evaluating wire used in winding applications where solderability and bonding behaviour matter. By linking the amendment to the parent document IEC 60317-35:2013, IEC 60317-35:2013/AMD2:2024 supports technical review, documented evaluation, and conformity assessment workflows without replacing the underlying specification.
What is IEC 60317-35:2013/AMD2:2024?
This document is a modifying reference connected to IEC 60317-35:2013, not a standalone product specification. As an amendment, IEC 60317-35:2013/AMD2:2024 is used to update or refine the requirements for solderable polyurethane enamelled round copper wire with a bonding layer and class 155 thermal designation. In practice, it helps align technical documentation, test planning, and compliance checks with the current published requirements when reviewing winding wire materials for engineering validation or quality workflows.
Applications of IEC 60317-35:2013/AMD2:2024
IEC 60317-35:2013/AMD2:2024 is typically relevant in workflows involving winding wire selection, incoming material review, and laboratory evaluation of enamelled copper wire intended for coil and winding construction. It may be used by teams assessing solderable wire performance, bonding-layer behaviour, and specification alignment for electrical equipment manufacturing. The amendment also supports procurement review and supplier documentation when a controlled technical reference is needed for product evaluation, production consistency, or conformity assessment preparation.
Why is IEC 60317-35:2013/AMD2:2024 important?
Using IEC 60317-35:2013/AMD2:2024 helps organizations maintain up-to-date technical compliance when working with a defined winding wire specification. It supports verification activities by giving reviewers a clear amendment trail tied to the parent document, which can reduce ambiguity during testing, acceptance checks, and engineering documentation control. For manufacturers and buyers, that improves risk management, quality assurance, and procurement decisions by keeping the technical basis for solderable polyurethane enamelled round copper wire consistent across internal and external assessment processes.
- Amendment tied to IEC 60317-35:2013 for controlled specification management
- Relevant to solderable polyurethane enamelled round copper wire with a bonding layer
- Supports testing workflows, documentation review, and conformity assessment
- Useful for procurement, laboratory evaluation, and engineering validation
- Publication Date: 2024-06-14
- Standard Status: Amendment
- Publisher: IEC
- Edition: 2
- This Version: IEC 60317-35:2013 (2024-06-14)
- Previous Version: IEC 60317-35:2013 (2019-12-06)
- Previous Version: IEC 60317-35:2013 (2013-10-14)
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