IEC 60317-36:2013/AMD2:2024
Amendment 2 - Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
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About This Item
IEC 60317-36:2013/AMD2:2024 defines Amendment 2 to the specifications for particular types of winding wires, focusing on solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer. For engineering teams, purchasing groups, and compliance reviewers, IEC 60317-36:2013/AMD2:2024 is relevant because it modifies the parent technical document and helps keep product evaluation, documented evaluation, and conformity assessment aligned with the current reference. It is especially useful where winding wire selection, material traceability, and technical validation are part of regulated or quality-controlled workflows.
Purpose of IEC 60317-36:2013/AMD2:2024
The purpose of this amendment is to update the parent specification for a defined winding wire construction used in electrical applications. By referencing solderable polyesterimide enamelled round copper wire with a bonding layer, the document supports technical review of insulation system requirements, material suitability, and manufacturing consistency. In practice, it serves as a supporting compliance reference for teams that must verify whether the amended requirements affect design records, test plans, procurement documents, or product qualification activities linked to IEC 60317-36:2013.
Compliance applications of IEC 60317-36:2013/AMD2:2024
Organizations may use this amendment when preparing technical files, updating acceptance criteria, or reviewing supplier documentation for winding wire intended for coils, motors, transformers, and similar electrical equipment. It can also be relevant in laboratory evaluation and testing workflows where product conformance must be checked against the parent specification as amended. For procurement and quality teams, IEC 60317-36:2013/AMD2:2024 helps ensure that specification control remains current during regulatory preparation, internal audits, and conformity assessment activities.
Benefits of IEC 60317-36:2013/AMD2:2024
Using the amendment alongside the parent document supports operational consistency and reduces the risk of working to outdated requirements. It can improve technical validation by giving engineering and test teams a clearer basis for comparing samples, reviewing material declarations, and confirming product acceptance criteria. For manufacturers and buyers, this helps strengthen quality workflows, support procurement decisions, and improve confidence in compliance documentation, especially where solderable enamelled copper wire is part of a safety- or performance-sensitive assembly.
- Amendment linked to IEC 60317-36:2013 for controlled use with the parent winding wire specification
- Relevant to solderable polyesterimide enamelled round copper wire with a bonding layer
- Useful for technical review, supplier evaluation, and conformity assessment preparation
- Supports documentation control in testing, procurement, and quality assurance workflows
- Publication Date: 2024-06-14
- Standard Status: Amendment
- Publisher: IEC
- Edition: 2
- This Version: IEC 60317-36:2013 (2024-06-14)
- Previous Version: IEC 60317-36:2013 (2019-12-06)
- Previous Version: IEC 60317-36:2013 (2013-10-14)
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