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IEC 60749-1:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

Standard by IEC, 2003-12-08

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About This Item

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IEC 60749-1:2002/COR1:2003 is a corrigendum to Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General, providing a supporting correction to the parent document IEC 60749-1:2002. For engineering teams, laboratories, and compliance reviewers, it matters because even small editorial or technical corrections can affect how mechanical and climatic test methods are interpreted and applied in verification activities. As a linked document rather than a standalone test method, it should be used alongside the parent reference in documented evaluation and conformity assessment workflows.

Purpose of IEC 60749-1:2002/COR1:2003

The purpose of IEC 60749-1:2002/COR1:2003 is to amend or clarify the general framework for mechanical and climatic test methods used for semiconductor devices. In practice, it supports more reliable technical assessment by correcting the parent text where needed, helping users align laboratory evaluation, engineering documentation, and test planning with the intended requirements. For organizations working on product validation or quality workflows, the corrigendum helps maintain consistency in how general test principles are read, applied, and referenced during compliance preparation.

Compliance applications of IEC 60749-1:2002/COR1:2003

IEC 60749-1:2002/COR1:2003 is typically relevant where semiconductor devices are being evaluated for mechanical or climatic robustness in controlled test environments. It may be used by test houses, device manufacturers, and procurement or assurance teams that need a corrected technical reference for verification activities, supplier documentation, or product evaluation records. In compliance workflows, the corrigendum can support traceability when the parent document is cited in test reports, internal specifications, or conformity assessment files tied to reliability and environmental testing.

Benefits of IEC 60749-1:2002/COR1:2003

Using IEC 60749-1:2002/COR1:2003 alongside the parent document can improve technical consistency and reduce the risk of misinterpretation during testing and review. It supports clearer engineering validation, more dependable procurement checks, and better alignment between laboratory procedures and documented requirements. For organizations managing semiconductor quality assurance, a corrigendum helps strengthen compliance preparation by ensuring that the referenced text reflects the corrected version. That can be important when results must withstand audit scrutiny or form part of a formal conformity assessment package.

  • Supporting corrigendum to the parent reference IEC 60749-1:2002
  • Relevant to mechanical and climatic test method interpretation for semiconductor devices
  • Useful in laboratory evaluation, test reporting, and documentation control
  • Helps maintain technical consistency in compliance and quality workflows
SKU: a9b91283780d

  • Publication Date: 2003-12-08
  • Standard Status: Corrigendum
  • Publisher: IEC
  • Edition: 1

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