IEC 60749-19:2003/AMD1:2010

IEC 60749-19:2003/AMD1:2010 is a supporting amendment to the parent document on semiconductor devices mechanical and climatic test methods, with a specific focus on die shear strength. It is relevant when engineering teams, laboratories, and procurement functions need a precise technical reference for evaluating die attachment integrity and related test documentation. As an amendment to IEC 60749-19:2003, it should be used as part of a documented evaluation and technical review workflow rather than treated as a standalone test method source.

Overview of IEC 60749-19:2003/AMD1:2010

This amendment modifies the parent reference for semiconductor device testing and is associated with mechanical and climatic qualification activities involving die shear strength. In practice, IEC 60749-19:2003/AMD1:2010 supports technical assessment of how a die is verified under shear loading, which may be important for product evaluation, laboratory evaluation, and conformity assessment preparation. Organizations often use the amended text to align internal test procedures, engineering documentation, and quality workflows with the current normative reference.

Compliance applications of IEC 60749-19:2003/AMD1:2010

IEC 60749-19:2003/AMD1:2010 is typically consulted in semiconductor manufacturing, qualification testing, and supplier approval processes where die attachment strength must be documented consistently. It can support testing workflows for component validation, incoming inspection, reliability programs, and design verification activities involving packaged devices. For teams managing compliance reference libraries, the amendment helps ensure that the applicable version linked to die shear strength testing is correctly identified during regulatory preparation, procurement review, and internal audit support.

Importance of compliance with IEC 60749-19:2003/AMD1:2010

Using the correct amended reference helps reduce ambiguity in test execution and reporting, which is important for engineering validation and technical compliance. Clear alignment with the parent document supports consistent results across laboratories, better risk management, and more reliable comparison of product evaluation data. For organizations working through qualification or conformity assessment, the amendment can improve traceability in test records and help avoid documentation gaps that may affect procurement acceptance, quality assurance, or release decisions.

• Supporting amendment linked to the parent die shear strength test method for semiconductor devices
• Relevant to mechanical test documentation and laboratory procedures for packaged components
• Useful for conformity assessment, supplier qualification, and engineering review records
• Helps maintain consistency in technical validation and quality workflows
• Assists teams that need the correct current reference for compliance preparation