IEC 60749-22:2002/COR1:2003

IEC 60749-22:2002/COR1:2003 is a corrigendum to the semiconductor device mechanical and climatic test methods document for bond strength, used to correct or clarify the parent reference IEC 60749-22:2002. For engineering teams, laboratories, and procurement professionals, it is relevant when bond strength testing needs to be aligned with the corrected technical record. In conformity assessment and technical review workflows, even a small corrigendum can matter because it helps maintain consistency in test interpretation, documentation, and product qualification activities.

What is IEC 60749-22:2002/COR1:2003?

This document is a supporting correction to the original semiconductor devices test method covering bond strength. As a corrigendum, IEC 60749-22:2002/COR1:2003 does not stand alone as a full testing standard; instead, it modifies or clarifies the parent text so users can apply the bond strength method with greater confidence. It is typically consulted during technical validation, laboratory evaluation, and compliance preparation where precise alignment with the referenced test method is important.

Applications of IEC 60749-22:2002/COR1:2003

Organizations working with semiconductor qualification, reliability testing, and quality workflows may use this corrigendum when reviewing procedures for bond strength measurement and reporting. It is relevant to test laboratories, component suppliers, and engineering teams preparing technical documentation for device assessment. In procurement and supplier auditing, it can support documented evaluation of whether a test program follows the corrected parent reference. It is also useful in verification activities where consistency in mechanical test interpretation is needed.

Why is IEC 60749-22:2002/COR1:2003 important?

For semiconductor test programs, accuracy in the source document helps reduce ambiguity and supports repeatable results. IEC 60749-22:2002/COR1:2003 matters because corrigenda are often used to improve technical consistency, which can affect engineering validation, conformity assessment preparation, and risk management. When bond strength is part of a qualification or acceptance workflow, using the corrected reference helps teams maintain operational consistency, strengthen quality assurance, and avoid misinterpretation during compliance review.

• Corrective reference connected to the parent bond strength test method
• Supports laboratory evaluation and test procedure alignment
• Useful for engineering documentation and procurement review
• Helps maintain consistency in semiconductor conformity assessment workflows
• Relevant where documented technical compliance depends on the updated source text