IEC 60749-31:2002/COR1:2003 PDF | Request Standard
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IEC 60749-31:2002/COR1:2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Standard by IEC, 2003-08-13

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About This Item

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IEC 60749-31:2002/COR1:2003 addresses a corrigendum linked to the mechanical and climatic test methods for semiconductor devices, specifically the flammability of plastic-encapsulated devices under internally induced conditions. As a supporting document to IEC 60749-31:2002, it is relevant when teams need to verify the correct technical text before using the parent test method in engineering, laboratory, or compliance workflows. For organizations managing product evaluation, technical review, or conformity assessment, IEC 60749-31:2002/COR1:2003 helps ensure the referenced method is applied with the intended editorial corrections in place.

IEC 60749-31:2002/COR1:2003 standard overview

IEC 60749-31:2002/COR1:2003 is a corrigendum, not a standalone test method, and it functions as a correction reference for the parent document IEC 60749-31:2002. Its role is to clarify or amend the published wording associated with the flammability test method for plastic-encapsulated semiconductor devices. In practice, this matters for technical documentation control, laboratory procedures, and procurement review, where the exact cited text can affect verification activities, test planning, and compliance records. The document supports more reliable interpretation of the parent method during quality workflows.

Applications of IEC 60749-31:2002/COR1:2003

This corrigendum is typically used by semiconductor manufacturers, test laboratories, and compliance teams that work with plastic-encapsulated devices and need controlled references for flammability-related evaluation. It may be consulted during internal engineering validation, supplier qualification, or document verification before formal testing is performed against the parent method. Procurement and regulatory preparation teams may also use it when confirming that technical files, test plans, and conformity assessment records refer to the corrected version of the underlying document. It is most useful where accuracy in standards citation is part of the workflow.

Why IEC 60749-31:2002/COR1:2003 matters

For operational use, IEC 60749-31:2002/COR1:2003 helps reduce ambiguity in test interpretation and supports consistency across engineering and laboratory processes. Even when a document is a corrigendum, it can be important for safety-related assessment, risk management, and documented evaluation because small wording corrections may affect how a test is executed or recorded. Including the correct reference also strengthens compliance workflows, improves traceability in technical documentation, and supports more dependable conformity assessment preparation for plastic-encapsulated semiconductor devices.

  • Correction reference connected to IEC 60749-31:2002 rather than a standalone test method
  • Relevant to flammability evaluation of plastic-encapsulated semiconductor devices under internally induced conditions
  • Useful for controlled technical documentation, test planning, and citation accuracy
  • Supports laboratory evaluation, quality assurance, and compliance review workflows
SKU: 2e94f190e3c8

  • Publication Date: 2003-08-13
  • Standard Status: Corrigendum
  • Publisher: IEC
  • Edition: 1

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