IEC 61188-6-2:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Available Formats:
- Availability: Immediate Download
- Language: English
- License Type: Single User
- Updates: Not Included
- Availability: Request Quote
- Language: English
- License Type: Enterprise / Multi User
- Updates: Included
About This Item
IEC 61188-6-2:2021 addresses land pattern design for circuit boards and circuit board assemblies, with a focus on describing land patterns for the most common surface mounted components (SMD). For engineering teams, procurement reviewers, and compliance professionals, it provides a structured technical reference for evaluating footprint-related design decisions and supporting documented evaluation. IEC 61188-6-2:2021 is relevant where layout consistency, manufacturability, and assembly compatibility must be considered during design review and technical validation.
Purpose of IEC 61188-6-2:2021
The purpose of this document is to define guidance for land pattern description so that common SMD component placement on printed circuit boards can be handled with greater consistency. In practical engineering workflows, that can support technical review, comparison of design intent against assembly requirements, and more reliable interpretation of footprint data. It is particularly useful when teams need a compliance reference during design development, quality workflows, or conformity assessment preparation for board-level electronics.
Compliance applications of IEC 61188-6-2:2021
IEC 61188-6-2:2021 is commonly used in PCB design, component footprint selection, and manufacturing documentation where land pattern definitions affect assembly behavior and operational consistency. It may support verification activities in electronics development, laboratory evaluation of board layouts, and procurement checks for design documentation alignment. Organizations working with circuit board assemblies can use it to strengthen technical assessment, reduce ambiguity in footprint specifications, and improve readiness for documented evaluation across engineering and testing workflows.
Benefits of IEC 61188-6-2:2021
By giving a clearer technical basis for common SMD land patterns, this document can help reduce layout uncertainty and improve engineering validation across design and manufacturing teams. It supports safer and more consistent board-level implementation by helping align footprint definitions with assembly expectations. That can assist with interoperability between design data and production processes, improve testing consistency, and lower risk during technical compliance reviews. For procurement and conformity assessment teams, it offers a focused technical document for evaluating whether design references are suitably controlled.
- Land pattern guidance for commonly used surface mounted components
- Support for PCB footprint review and engineering documentation
- Useful reference for conformity assessment and technical validation workflows
- Helps improve consistency between design intent and assembly requirements
- Publication Date: 2021-04-02
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61188-6-2:2021 (2021-04-02)
Please request information about the document. Contact Page
Need This Standard?
Request a personalized quote today to receive the latest edition in PDF or other available formats.
Need This Standard?
Request a personalized quote today to receive the latest edition in PDF or other available formats.
Summarize with AI
Get quick summaries using your favorite AI engine.
Online Standart Disclaimer
OnlineStandart.com is an authorized reseller of international standards, operating through partnerships with authorized distributors. We do not own the copyrights or trademarks of the standards we sell, including but not limited to those of API, ASHRAE, BSI, SAE, ASTM, IEEE, IEC, ASME, ISO, and others.
All product names, logos, and brands are the property of their respective owners and are used for identification purposes only; their use does not imply endorsement. OnlineStandart.com is not affiliated with or endorsed by any standards development organization unless explicitly stated. The content of this document is for informational purposes only and is intended to promote our licensed reselling services.
Online Standart does not host, distribute, or link to free, unlicensed, or uncertified copies of copyrighted standards. Every document we deliver is a licensed copy obtained through authorized channels and supplied with full licensing documentation. The “Free PDF Download” option on our product pages refers to this free informational document — never to a free copy of any standard.