IEC 61188-6-3:2024
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
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About This Item
IEC 61188-6-3:2024 addresses land pattern design for through hole components (THT) in circuit boards and circuit board assemblies, providing a focused technical reference for PCB footprint description and use. For engineering teams, layout designers, and procurement or compliance reviewers, IEC 61188-6-3:2024 can support more consistent interpretation of land pattern requirements and help align design documentation with manufacturing and verification activities. Its relevance is strongest where reliable component placement, assembly compatibility, and documented evaluation are part of the workflow.
What is IEC 61188-6-3:2024?
IEC 61188-6-3:2024 is part of the IEC 61188 series on circuit boards and circuit board assemblies, with a specific focus on land pattern design for through hole components. The title indicates that it is intended to describe how land patterns should be defined and used for THT devices, supporting engineering documentation and technical review. In practice, it is likely used as a compliance reference during footprint creation, design validation, and manufacturing preparation where consistent board-to-component interface definition is important.
Applications of IEC 61188-6-3:2024
This document is relevant in PCB design, electronic assembly planning, and technical assessment workflows where through hole component footprints must be specified with precision. It may be used by design engineers, CAM teams, test laboratories, and quality groups evaluating land pattern consistency across product variants or suppliers. IEC 61188-6-3:2024 can also support documented evaluation during procurement review, especially when engineering specifications must be checked against assembly capability, verification activities, and operational consistency requirements.
Why is IEC 61188-6-3:2024 important?
Accurate land pattern definition helps reduce assembly risk, improve interoperability between components and circuit boards, and strengthen technical validation before production release. IEC 61188-6-3:2024 is important because it supports clearer engineering documentation, more consistent testing workflows, and better conformity assessment preparation. For organizations managing quality assurance or regulatory preparation, a well-defined footprint reference can reduce interpretation gaps, support repeatable review processes, and improve confidence in design-for-manufacture decisions.
- Technical reference for describing land patterns for through hole components on circuit boards and assemblies
- Useful for footprint creation, layout review, and engineering documentation control
- Supports verification activities, design validation, and manufacturing readiness checks
- Helps align procurement, compliance, and quality workflows around a defined PCB land pattern basis
- Relevant to teams assessing assembly consistency and reducing footprint-related implementation risk
- Publication Date: 2024-09-12
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61188-6-3:2024 (2024-09-12)
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