IEC 61189-2-801:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
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About This Item
IEC 61189-2-801:2023 is a technical reference for thermal conductivity testing of base materials used in printed boards and other interconnection structures and assemblies. It is relevant when engineering teams, laboratories, and procurement specialists need a documented evaluation method for material thermal behavior during product assessment, qualification, or conformity assessment. For organizations working with electronic interconnection materials, the document supports more consistent technical review and helps align testing workflows with a recognized method.
Purpose of IEC 61189-2-801:2023
The purpose of IEC 61189-2-801:2023 is to define a test method for measuring the thermal conductivity of base materials used in printed boards and related interconnection structures. That makes it useful in engineering documentation where heat transfer characteristics may affect design decisions, material selection, or performance validation. By providing a common testing reference, it can support documented evaluation, comparison between materials, and more consistent technical assessment during development and compliance preparation.
Compliance applications of IEC 61189-2-801:2023
IEC 61189-2-801:2023 is typically used in laboratory evaluation, supplier review, and product qualification for electronic materials and assemblies where thermal performance needs to be verified. It may be referenced in testing workflows for printed boards, interconnection systems, or related base materials when organizations need evidence for technical compliance, quality assurance, or procurement decisions. The document can also support regulatory preparation and internal verification activities when thermal conductivity is a relevant design or acceptance parameter.
Benefits of IEC 61189-2-801:2023
Using IEC 61189-2-801:2023 helps teams apply a consistent method for thermal conductivity testing, which can improve testing consistency and reduce ambiguity in technical review. This is valuable for engineering validation, risk management, and conformity assessment preparation because material behavior is documented using a recognized approach. It can also support interoperability decisions across suppliers and manufacturing sites, while giving procurement and quality teams a clearer compliance reference during material selection and acceptance.
- Supports thermal conductivity assessment for printed board base materials and related interconnection structures
- Useful for laboratory test planning, material qualification, and documented evaluation
- Helps align engineering validation with procurement and quality workflows
- Provides a practical reference for compliance preparation and technical assessment
- Assists with consistent comparison of material performance in electronic applications
- Publication Date: 2023-07-26
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61189-2-801:2023 (2023-07-26)
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