IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
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About This Item
IEC 61189-2-805:2024 defines a test method for evaluating X/Y coefficient of thermal expansion (CTE) in thin base materials using TMA, making it a relevant technical reference for material characterization and product evaluation. For engineers and laboratories working with printed boards and other interconnection structures, the document supports documented evaluation of dimensional stability under thermal influence. It is especially useful where consistent testing workflows, technical review, and compliance preparation depend on repeatable measurement of substrate behavior during development, qualification, or procurement.
IEC 61189-2-805:2024 standard overview
IEC 61189-2-805:2024 sits within the test methods framework for electrical materials, printed boards, and related interconnection structures and assemblies. Its focus on X/Y CTE testing for thin base materials by TMA points to a laboratory-based method for assessing thermal expansion behavior in the plane of the material. That makes it relevant to technical validation, engineering documentation, and conformity assessment activities where material performance must be understood before use in higher-reliability assemblies or manufacturing processes.
Applications of IEC 61189-2-805:2024
This document is typically used in materials testing, printed board qualification, and laboratory evaluation of thin laminates or base materials intended for electronic interconnection structures. It may support supplier comparison, incoming inspection, process development, and failure analysis where thermal movement in the X/Y directions affects design margins or assembly stability. In practice, it can be valuable during engineering assessment of substrates used in electronics manufacturing, especially when procurement teams and test laboratories need a shared compliance reference for thermal characterization.
Why IEC 61189-2-805:2024 matters
Consistent CTE measurement helps reduce risk in design and manufacturing decisions, particularly where thermal expansion can influence dimensional accuracy, reliability, and operational consistency. IEC 61189-2-805:2024 provides a defined testing approach that can support quality workflows, regulatory preparation, and technical assessment across suppliers or internal projects. For organizations managing qualification, verification activities, or conformity assessment preparation, having a clear method for X/Y CTE testing improves comparability of results and supports more confident procurement and engineering review.
- Test method for X/Y coefficient of thermal expansion measurement using TMA
- Relevant to thin base materials used in printed boards and interconnection structures
- Supports laboratory evaluation, material qualification, and technical validation
- Useful for procurement review, supplier documentation, and conformity assessment workflows
- Helps improve consistency in thermal characterization and risk management
- Publication Date: 2024-04-18
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61189-2-805:2024 (2024-04-18)
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