IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
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About This Item
IEC 61189-2-807:2021 defines a test method for materials used in interconnection structures and assemblies, focusing on decomposition temperature (Td) using TGA. For engineers and laboratories evaluating printed boards and related materials, it provides a structured technical reference for documented evaluation, material comparison, and compliance workflows. IEC 61189-2-807:2021 is relevant where thermal stability data is needed to support technical review, procurement decisions, and qualification activities for electronic interconnection materials.
Purpose of IEC 61189-2-807:2021
The purpose of IEC 61189-2-807:2021 is to describe a consistent method for determining decomposition temperature through thermogravimetric analysis. In practical terms, it helps align laboratory evaluation and engineering validation when assessing material behavior under elevated temperature conditions. For organizations working with printed boards or other interconnection structures, the document supports a repeatable approach to comparing materials, documenting test results, and using thermal degradation data within broader quality workflows and technical assessment processes.
Compliance applications of IEC 61189-2-807:2021
This testing standard is commonly used in conformity assessment, supplier qualification, and product evaluation activities where material thermal performance must be documented. It may support compliance preparation for interconnection materials selected for electrical equipment, assemblies, or related manufacturing processes. Laboratories and procurement teams can use the method as part of technical validation, while engineering groups may reference it during material selection, failure analysis, or operational consistency reviews. IEC 61189-2-807:2021 is most useful where repeatable Td data is needed for a defensible compliance reference.
Benefits of IEC 61189-2-807:2021
Using IEC 61189-2-807:2021 can improve testing consistency and reduce ambiguity in thermal characterization of interconnection materials. That supports safer engineering decisions, better risk management, and stronger procurement review by giving stakeholders a common basis for comparison. The method also helps with conformity assessment preparation by producing documented evidence that can be incorporated into technical documentation, quality assurance records, and regulatory preparation activities. For teams validating material suitability, it can improve confidence in performance expectations and support more reliable technical decision-making.
- Thermogravimetric analysis method for decomposition temperature of interconnection materials
- Useful for printed boards and other interconnection structures and assemblies
- Supports laboratory evaluation, material comparison, and technical documentation
- Helpful in compliance workflows, supplier review, and qualification activities
- Provides a consistent basis for thermal stability assessment and risk reduction
- Publication Date: 2021-03-09
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61189-2-807:2021 (2021-03-09)
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