IEC 61189-2-809:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
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About This Item
IEC 61189-2-809:2024 is the technical reference for X/Y coefficient of thermal expansion (CTE) testing of thick base materials by TMA, helping engineers and laboratories evaluate how these materials behave under thermal stress. It is relevant where dimensional stability, material characterization, and documented evaluation are needed for circuit boards and related interconnection structures. For procurement, testing, and compliance workflows, IEC 61189-2-809:2024 supports a more consistent basis for technical review, verification activities, and engineering documentation.
Overview of IEC 61189-2-809:2024
This document addresses a test method for determining X/Y CTE on thick base materials using thermomechanical analysis. In practice, that makes it useful when assessing material response in directions that matter for circuit board performance and assembly reliability. As Part 2-809 of the IEC 61189 series, it fits into a broader testing framework for electrical materials and interconnection structures, giving laboratories and engineering teams a defined compliance reference for repeatable technical assessment and data-driven comparison.
Compliance applications of IEC 61189-2-809:2024
IEC 61189-2-809:2024 is commonly used in laboratory evaluation, incoming material qualification, supplier documentation review, and product evaluation for thick base materials used in electronic build-ups and related assemblies. It may also support regulatory preparation and conformity assessment where thermal expansion data is needed to compare candidate materials or validate design assumptions. Organizations involved in quality workflows and testing workflows can use the method to improve consistency when documenting thermal behavior for engineering validation.
Importance of compliance with IEC 61189-2-809:2024
Using a recognized testing standard for X/Y CTE helps reduce uncertainty in material selection and supports operational consistency across different labs or procurement programs. Reliable thermal expansion data is important for risk management, because mismatched material behavior can affect assembly integrity, dimensional control, and long-term performance. For manufacturers and purchasers, alignment with IEC 61189-2-809:2024 can strengthen technical compliance, improve conformity assessment preparation, and provide a clearer basis for quality assurance and engineering review.
- Test method for X/Y coefficient of thermal expansion measurement by TMA
- Relevant to thick base materials used in circuit boards and interconnection structures
- Useful for laboratory evaluation, supplier comparison, and documented material qualification
- Supports technical validation, quality workflows, and compliance-focused review
- Publication Date: 2024-09-12
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61189-2-809:2024 (2024-09-12)
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