IEC 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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About This Item
IEC 61189-3-719:2016 defines a test method for monitoring single plated-through hole (PTH) resistance change during temperature cycling, making it a focused reference for printed board reliability evaluation. It is relevant when engineering teams, laboratories, and procurement specialists need a documented way to assess how interconnection structures behave under repeated thermal stress. For organizations working through verification activities, technical assessment, or conformity assessment, IEC 61189-3-719:2016 supports a more consistent approach to comparing results and documenting performance trends.
Purpose of IEC 61189-3-719:2016
The purpose of IEC 61189-3-719:2016 is to provide a structured method for observing resistance variation in a single plated-through hole during temperature cycling. Based on the official title, the document is centered on printed boards and interconnection structures, where changes in PTH resistance can indicate degradation or instability. This makes the reference useful for technical review, documented evaluation, and laboratory evaluation when assessing board reliability under thermal stress conditions.
Compliance applications of IEC 61189-3-719:2016
IEC 61189-3-719:2016 is typically used in testing workflows for printed board qualification, product evaluation, and compliance workflows involving interconnection reliability. It may support engineering documentation for electronics manufacturing, reliability studies, and acceptance testing where temperature cycling is part of the validation plan. The reference is also useful when organizations need a repeatable testing standard to compare test outcomes across suppliers, development programs, or quality assurance activities tied to technical compliance.
Benefits of IEC 61189-3-719:2016
Using IEC 61189-3-719:2016 can improve testing consistency and help reduce risk in procurement, design validation, and conformity assessment preparation. By focusing on a single plated-through hole resistance change during thermal cycling, it supports clearer technical validation of printed board interconnections and helps teams document reliability evidence in a controlled way. That can be valuable for quality workflows, operational consistency, and engineering decisions where predictable thermal performance is important.
- Test method for monitoring resistance change in a single plated-through hole during temperature cycling
- Relevant to printed board reliability assessment and interconnection structure evaluation
- Supports laboratory testing, qualification work, and documented technical review
- Useful for compliance preparation, supplier comparison, and quality assurance records
- Publication Date: 2016-05-01
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61189-3-719:2016 (2016-05-01)
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