IEC 61191-2:2017/COR1:2019
Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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About This Item
IEC 61191-2:2017/COR1:2019 is a corrigendum connected to Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies, providing a supporting correction to the parent document IEC 61191-2:2017. For engineering, procurement, and compliance teams, it matters because even small textual or technical corrections can affect how surface mount soldered assemblies are specified, reviewed, and verified. IEC 61191-2:2017/COR1:2019 should be used as part of a controlled technical document set when evaluating conformity, preparing test plans, or aligning internal quality workflows.
Overview of IEC 61191-2:2017/COR1:2019
This corrigendum is best understood as a modifying reference rather than a standalone requirement set. It is associated with the sectional specification for surface mount soldered assemblies, which indicates relevance to printed board assembly requirements, technical review, and documented evaluation of soldered construction. In practice, organizations may use IEC 61191-2:2017/COR1:2019 to ensure that the parent document is applied with the correct wording and intent during design control, verification activities, and compliance documentation. The correction supports operational consistency in engineering documentation and assessment processes.
Compliance applications of IEC 61191-2:2017/COR1:2019
IEC 61191-2:2017/COR1:2019 is relevant where printed board assemblies with surface mount soldered connections are being specified, inspected, or released through quality workflows. It may be consulted during supplier review, incoming inspection criteria development, test preparation, and conformity assessment preparation for electronics manufacturing or assembly environments. Compliance teams often rely on corrigenda to keep technical files aligned with the intended requirements of the parent specification, reducing ambiguity during technical validation, procurement review, and laboratory evaluation of assembly quality.
Importance of compliance with IEC 61191-2:2017/COR1:2019
Using the corrigendum alongside the parent document helps reduce the risk of specification errors, inconsistent interpretation, and avoidable rework in manufacturing or testing workflows. For organizations responsible for safety, reliability, and quality assurance, even a corrective document can influence how acceptance criteria are understood and applied. IEC 61191-2:2017/COR1:2019 supports clearer conformity assessment preparation, more consistent engineering validation, and stronger technical compliance across documentation, procurement, and inspection activities related to surface mount soldered assemblies.
- Corrective reference linked to IEC 61191-2:2017 for controlled document management
- Relevant to printed board assemblies using surface mount soldered construction
- Useful for technical review, quality workflows, and verification planning
- Supports conformity assessment and procurement alignment with the parent specification
- Publication Date: 2019-09-16
- Standard Status: Corrigendum
- Publisher: IEC
- Edition: 3
- This Version: IEC 61191-2:2017 (2019-09-16)
- Previous Version: IEC 61191-2:2017 (2017-05-23)
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