IEC 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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About This Item
IEC 61191-6:2010 provides technical guidance for evaluating voids in soldered joints of BGA and LGA printed board assemblies and for applying a measurement method. It is relevant where solder joint quality affects functional reliability, rework decisions, and acceptance criteria during inspection or production release. For engineering teams and procurement groups, IEC 61191-6:2010 supports documented evaluation and more consistent technical review when assessing board assembly quality against defined performance criteria.
What is IEC 61191-6:2010?
IEC 61191-6:2010 is focused on printed board assemblies using ball grid array and land grid array packages, where voids in soldered joints may influence assembly integrity and long-term performance. The document is primarily a compliance reference for defining how such voids are evaluated and measured in a controlled way. In quality workflows, it can help laboratories, manufacturers, and buyers align verification activities, technical validation, and conformity assessment around a common inspection basis.
Applications of IEC 61191-6:2010
This document is commonly used in electronics manufacturing, assembly inspection, and laboratory evaluation for printed circuit board products containing BGA or LGA components. It may support incoming inspection, process qualification, failure analysis, and acceptance decisions where solder joint condition must be reviewed against a documented criterion. It is also useful in procurement and supplier quality workflows when defining technical requirements for assembled boards, especially where operational consistency and repeatable measurement are needed.
Why is IEC 61191-6:2010 important?
Voids in solder joints can affect reliability, inspection outcomes, and the confidence of technical acceptance decisions, so a clear method for evaluation is valuable. IEC 61191-6:2010 helps reduce ambiguity in testing workflows by providing a structured basis for measurement and review. That supports safer engineering validation, stronger quality assurance, and more consistent compliance preparation. It can also improve communication between design, production, laboratory, and procurement teams when documenting solder joint performance criteria.
- Evaluation criteria for voids in soldered joints of BGA and LGA printed board assemblies
- Measurement method support for inspection and laboratory review
- Useful for quality workflows, supplier assessment, and conformity assessment preparation
- Relevant to acceptance decisions, technical documentation, and risk reduction in assembly validation
- Publication Date: 2010-01-14
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61191-6:2010 (2010-01-14)
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