IEC 61249-2-35:2008
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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About This Item
IEC 61249-2-35:2008 defines requirements for reinforced base materials used in printed boards and other interconnecting structures, specifically modified epoxide woven E-glass laminate sheets of defined flammability for copper-clad, lead-free assembly applications. It is relevant when teams need a technical reference for material selection, procurement review, and documented evaluation of PCB substrate properties. As IEC 61249-2-35:2008, it supports engineering and compliance workflows where the laminate material must align with specified construction and flammability expectations.
Overview of IEC 61249-2-35:2008
This document focuses on a particular class of base material used in printed board manufacturing and related interconnecting structures. Its scope is centered on reinforced, copper-clad and unclad laminate sheets based on modified epoxide woven E-glass, with defined flammability characteristics suited to lead-free assembly needs. For engineering teams, the value lies in providing a shared technical reference for product qualification, material specification, and supplier assessment. It is typically used to support technical review and conformity assessment rather than general-purpose product design.
Compliance applications of IEC 61249-2-35:2008
IEC 61249-2-35:2008 may be used in PCB material procurement, incoming inspection planning, supplier documentation checks, and laboratory evaluation of laminate suitability for printed board production. It is especially relevant where lead-free assembly processes require materials selected with controlled flammability behavior and consistent construction. In practice, organizations can use it to support product evaluation, technical validation, and quality workflows tied to electronic hardware manufacturing, component sourcing, and documented compliance preparation.
Importance of compliance with IEC 61249-2-35:2008
Using IEC 61249-2-35:2008 in engineering and procurement workflows helps reduce material mismatch risk and supports operational consistency across board fabrication and assembly processes. It can improve testing consistency by giving laboratories and suppliers a common technical target for material assessment. For compliance teams, it also aids conformity assessment preparation, especially when evidence is needed to show that selected laminate materials align with defined construction and flammability expectations. This contributes to better quality assurance and more controlled technical documentation.
- Base material requirements for reinforced printed board and interconnecting structures
- Modified epoxide woven E-glass laminate sheets with defined flammability characteristics
- Copper-clad and unclad material selection for lead-free assembly workflows
- Support for supplier review, laboratory evaluation, and engineering documentation
- Useful reference for procurement decisions and compliance-oriented technical assessment
- Publication Date: 2008-11-27
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61249-2-35:2008 (2008-11-27)
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