IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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About This Item
IEC 61249-2-46:2018 defines requirements for reinforced base materials used in printed boards and other interconnecting structures, specifically non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets with thermal conductivity of 1,5 W/(m•K), defined flammability performance, and copper-clad construction for lead-free assembly. For engineering, procurement, and compliance teams, IEC 61249-2-46:2018 is a relevant technical reference when evaluating laminate materials intended for heat management and board fabrication workflows. It supports documented material selection, product evaluation, and conformity assessment against a clearly defined material specification.
What is IEC 61249-2-46:2018?
This document is part of the IEC 61249 series for materials used in printed boards and related interconnecting structures. Its scope is focused on a particular reinforced base material format: non-halogenated epoxide laminate sheets with E-glass reinforcement, specified thermal conductivity, and copper-clad suitability for lead-free assembly. In practice, IEC 61249-2-46:2018 helps align supplier data, engineering documentation, and technical review activities around a consistent material reference. It is especially useful where material performance, flammability behavior, and fabrication compatibility need to be checked during design qualification or procurement.
Applications of IEC 61249-2-46:2018
IEC 61249-2-46:2018 is typically used in workflows involving printed board material specification, incoming material review, and laboratory evaluation of copper-clad laminate products. It may be relevant to manufacturers, PCB fabricators, component suppliers, and test laboratories assessing materials for electronic assemblies that require lead-free processing and controlled thermal behavior. The document can also support purchasing decisions, technical comparison of candidate substrates, and preparation of compliance records for product development projects where board material selection affects performance, safety, and operational consistency.
Why is IEC 61249-2-46:2018 important?
As a product-specific technical reference, IEC 61249-2-46:2018 helps reduce ambiguity in material selection and verification activities. It supports testing consistency by giving engineering and quality teams a common baseline for documented evaluation of reinforced laminate sheets used in interconnecting structures. That can be important for safety, conformity assessment preparation, and procurement review, particularly when lead-free assembly compatibility and defined flammability behavior are part of the technical requirement set. Using a precise material specification also helps limit supply-chain risk and improve traceability in quality workflows.
- Reinforced base material specification for printed boards and related interconnecting structures
- Non-halogenated epoxide laminate with E-glass reinforcement and copper-clad construction
- Relevant for lead-free assembly qualification, material selection, and technical validation
- Useful in procurement, laboratory evaluation, and compliance documentation workflows
- Publication Date: 2018-10-01
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC 61249-2-46:2018 (2018-10-01)
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