IEC 61760-4:2015/AMD1:2018
Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
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About This Item
IEC 61760-4:2015/AMD1:2018 is an amendment to the document on surface mounting technology that addresses classification, packaging, labelling, and handling of moisture sensitive devices. It is relevant where product integrity depends on controlled handling before assembly, storage, or processing. For engineering teams, laboratories, and procurement functions, the reference helps align technical documentation and operational practice with the parent document, IEC 61760-4:2015, when moisture-sensitive components must be managed within quality workflows, documented evaluation, and conformity assessment activities.
Purpose of IEC 61760-4:2015/AMD1:2018
The purpose of IEC 61760-4:2015/AMD1:2018 is to modify and support the parent document by clarifying or updating requirements connected to the classification, packaging, labelling, and handling of moisture sensitive devices used in surface mounting technology. In practice, such guidance helps reduce handling-related risk, supports technical review of component controls, and improves operational consistency across receiving, storage, and production environments. It is especially useful where documented procedures are needed for technical validation and procurement review.
Compliance applications of IEC 61760-4:2015/AMD1:2018
Organizations may use IEC 61760-4:2015/AMD1:2018 when evaluating moisture-sensitive electronic components for incoming inspection, warehouse control, assembly preparation, and release to production. It can support compliance workflows that depend on clear packaging and labelling conventions, as well as handling rules that reduce exposure before mounting. The amendment is most relevant to teams working with surface-mounted electrical equipment, product evaluation records, and manufacturing processes that require traceable documentation for technical compliance and conformity assessment preparation.
Benefits of IEC 61760-4:2015/AMD1:2018
Using IEC 61760-4:2015/AMD1:2018 alongside the parent reference can improve testing consistency and quality assurance by helping organizations define how moisture-sensitive devices are identified and controlled. That supports safer handling, lower risk of component damage, and more reliable engineering validation during assembly and inspection. For procurement and compliance teams, it also provides a focused technical document for documenting obligations, aligning supplier requirements, and reducing uncertainty during audit or regulatory preparation.
- Supporting amendment to IEC 61760-4:2015 for moisture-sensitive surface-mount devices
- Relevant to packaging, labelling, and handling controls in electronics workflows
- Useful for incoming inspection, storage, and assembly release procedures
- Helps strengthen documentation for conformity assessment and technical review
- Publication Date: 2018-03-13
- Standard Status: Amendment
- Publisher: IEC
- Edition: 1
- This Version: IEC 61760-4:2015 (2018-03-13)
- Previous Version: IEC 61760-4:2015 (2015-05-19)
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