IEC 61837-1:2012
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines
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About This Item
IEC 61837-1:2012 defines the standard outlines and terminal lead connections for surface mounted piezoelectric devices used for frequency control and selection, with a focus on plastic moulded enclosure outlines. It is relevant when engineers, buyers, and compliance teams need a reliable technical document for package dimensions and connection conventions during product selection, board design, and incoming verification. By establishing a shared mechanical reference, IEC 61837-1:2012 supports clearer communication between component suppliers, laboratories, and manufacturing teams working on precision electronic assemblies.
Purpose of IEC 61837-1:2012
The purpose of IEC 61837-1:2012 is to provide a consistent outline reference for plastic moulded surface mounted piezoelectric devices, helping reduce ambiguity in mechanical integration and component documentation. In practical engineering workflows, it supports technical review of package fit, lead arrangement, and assembly compatibility for frequency control and selection components. The document is useful when organizations need a dependable compliance reference for drawings, part libraries, and procurement specifications tied to dimensional conformity and operational consistency.
Compliance applications of IEC 61837-1:2012
IEC 61837-1:2012 is commonly used in product evaluation, drawing control, and conformity assessment for electronic hardware that incorporates surface mounted piezoelectric devices. It can support verification activities in laboratories, design teams, and supply chain reviews where enclosure outline and terminal lead connection details must be checked against the declared reference. The standard is also relevant for engineering documentation, technical validation, and regulatory preparation when precise package definition is needed before release, qualification, or supplier acceptance.
Benefits of IEC 61837-1:2012
Using IEC 61837-1:2012 can improve testing consistency, reduce integration risk, and strengthen procurement decisions by aligning everyone to a common mechanical reference. For manufacturers and compliance teams, it helps support quality assurance, interoperability across design and assembly workflows, and clearer conformity assessment preparation. In environments where frequency control components must be documented accurately, the standard can also assist with engineering validation and traceability, lowering the chance of mismatched outlines or terminal connection assumptions during implementation.
- Standard outline reference for plastic moulded surface mounted piezoelectric devices
- Terminal lead connection guidance for documentation and component comparison
- Useful for drawing checks, part approval, and mechanical fit assessment
- Supports compliance workflows, verification activities, and supplier review
- Publication Date: 2012-04-20
- Standard Status: Original
- Publisher: IEC
- Edition: 2
- This Version: IEC 61837-1:2012 (2012-04-20)
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