IEC 61837-2:2018/AMD1:2020
Amendment 1 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
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About This Item
IEC 61837-2:2018/AMD1:2020 is a focused amendment linked to the parent document for surface mounted piezoelectric devices for frequency control and selection, specifically the part covering ceramic enclosures and standard outlines with terminal lead connections. It is relevant where engineers and procurement teams need a current technical reference for package form, mounting interface, and connection arrangement in documented evaluation or conformity assessment workflows. As an amendment to IEC 61837-2:2018, it should be used as a supporting update within engineering documentation and compliance review.
Overview of IEC 61837-2:2018/AMD1:2020
The document updates the technical basis for ceramic enclosures used with surface mounted piezoelectric devices, helping define how outline dimensions and terminal lead connections are described for consistent product specification. IEC 61837-2:2018/AMD1:2020 is typically consulted during technical review, drawing control, and parts qualification when teams need alignment between component documentation and manufacturing expectations. For organizations managing quality workflows or technical validation, it provides an authoritative amendment to the parent reference rather than a separate standalone design rule.
Compliance applications of IEC 61837-2:2018/AMD1:2020
Typical use cases include component selection, packaging verification, and specification checks for devices intended for frequency control or selection functions. The amendment may support laboratory evaluation, procurement review, and conformity assessment preparation by clarifying the approved reference frame for ceramic enclosure outlines and lead connections. In practice, IEC 61837-2:2018/AMD1:2020 can be useful where engineering teams must confirm that device documentation, interface details, and related technical records remain consistent across development, testing workflows, and supplier qualification.
Importance of compliance with IEC 61837-2:2018/AMD1:2020
Using the amendment alongside the parent document helps reduce interpretation errors in product definition and supports operational consistency across design, verification activities, and sourcing decisions. For compliance teams, it can improve testing consistency and strengthen technical assessment by anchoring reviews to a defined ceramic enclosure reference. That matters when organizations are preparing documentation for quality assurance, procurement acceptance, or regulatory preparation, especially where small differences in package outline or terminal connection details may affect fit, assembly, or downstream conformity assessment.
- Amendment linked to the parent reference IEC 61837-2:2018 for ceramic enclosure definitions
- Relevant to surface mounted piezoelectric devices used in frequency control and selection applications
- Supports review of standard outlines and terminal lead connection details in technical documentation
- Useful for drawing control, supplier evaluation, and product qualification workflows
- Helps maintain consistency in compliance reference sets and engineering validation records
- Publication Date: 2020-09-24
- Standard Status: Amendment
- Publisher: IEC
- Edition: 3
- This Version: IEC 61837-2:2018 (2020-09-24)
- Previous Version: IEC 61837-2:2018 (2018-08-05)
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