IEC 61837-3:2015
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures
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About This Item
IEC 61837-3:2015 addresses standard outlines and terminal lead connections for surface mounted piezoelectric devices used for frequency control and selection, with a specific focus on metal enclosures. For engineers, buyers, and compliance teams, it provides a technical reference for identifying the package-related features that affect mounting, interchangeability, and documented evaluation. IEC 61837-3:2015 is relevant when consistency in component form factor and connection layout is needed to support procurement, technical review, and conformity assessment activities.
IEC 61837-3:2015 standard overview
This document forms part of the IEC 61837 series and concentrates on the outline and terminal lead connection arrangements associated with metal-enclosed surface mounted piezoelectric devices. Its likely purpose is to support dimensional compatibility and interface consistency across frequency control and selection components. In engineering and quality workflows, it may be used as a compliance reference when comparing supplier parts, preparing drawings, or checking whether a device configuration aligns with an established package definition for technical validation.
Applications of IEC 61837-3:2015
The content is most relevant where surface mounted piezoelectric devices are specified for electronics that depend on stable frequency control or selection behavior. Typical use cases may include component engineering documentation, laboratory evaluation, incoming inspection, and supplier qualification for metal-enclosed parts. It can also support procurement review and design verification when a team needs a common reference for outlines and terminal lead connections during product evaluation, especially in workflows that require operational consistency across different manufacturers or device sources.
Why IEC 61837-3:2015 matters
Using a defined package reference helps reduce ambiguity during technical assessment, particularly when several suppliers offer similar devices with different physical interfaces. That matters for compliance workflows, because outline and lead connection data often influence assembly fit, verification activities, and documentation control. IEC 61837-3:2015 can therefore support risk reduction, testing consistency, and conformity assessment preparation by giving organizations a shared basis for comparison, acceptance checks, and engineering validation of metal-enclosed piezoelectric components.
- Standardized outline and terminal lead connection reference for metal-enclosed surface mounted piezoelectric devices
- Useful for dimensional comparison, drawing review, and part interchangeability checks
- Supports procurement, incoming inspection, and supplier technical evaluation workflows
- Helps align documentation used in compliance preparation and product verification
- Publication Date: 2015-04-15
- Standard Status: Original
- Publisher: IEC
- Edition: 2
- This Version: IEC 61837-3:2015 (2015-04-15)
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