IEC 62148-19:2019

IEC 62148-19:2019 defines package and interface requirements for a photonic chip scale package used in fibre optic active components and devices. It is relevant when engineering teams, suppliers, and test laboratories need a common technical reference for package-level integration, interface alignment, and documented evaluation. By focusing on the photonic chip scale package, IEC 62148-19:2019 supports more consistent product assessment, procurement review, and conformity assessment activities where optical component packaging directly affects interoperability and implementation quality.

Purpose of IEC 62148-19:2019

The purpose of IEC 62148-19:2019 is to provide a structured technical basis for the package and interface standards associated with photonic chip scale packages. In practical workflows, it helps define how such components are reviewed during engineering documentation, technical assessment, and verification activities. For organizations involved in optical device development or supplier qualification, the document can support clearer design expectations, more repeatable testing workflows, and better alignment between product evaluation and compliance preparation.

Compliance applications of IEC 62148-19:2019

IEC 62148-19:2019 is typically used in compliance workflows for fibre optic active components and devices that rely on photonic chip scale packaging. It may be referenced during laboratory evaluation, product qualification, and technical review of packaging and interface characteristics before release or procurement approval. The document is also useful for teams preparing engineering specifications, comparing vendor submissions, or establishing documented evaluation steps for optical hardware intended to fit into broader system integration and conformity assessment processes.

Benefits of IEC 62148-19:2019

Using IEC 62148-19:2019 can improve operational consistency by giving engineering, quality, and procurement teams a shared reference for package-related expectations. That can reduce risk during technical validation, support more reliable interoperability checks, and help structure testing and compliance documentation. For organizations managing optical component sourcing or product certification, the standard can also improve traceability in quality assurance processes and make conformity assessment preparation more efficient by clarifying the relevant package and interface framework.

• Package and interface reference for photonic chip scale package implementations
• Supports engineering review, supplier comparison, and technical documentation
• Useful for verification activities and laboratory evaluation of optical components
• Helps align procurement and conformity assessment workflows with defined package expectations