IEC 62148-21:2021

IEC 62148-21:2021 defines design guidelines for the electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). It is relevant for engineers and compliance teams that need a technical reference for package interface planning, documentation, and verification activities around photonic integrated circuit packaging. As a primary technical document, IEC 62148-21:2021 helps support consistent engineering review, procurement checks, and conformity assessment preparation when electrical interface details must be handled with care.

Overview of IEC 62148-21:2021

The focus of IEC 62148-21:2021 is the electrical interface design guidance for PIC packages that use S-FBGA and S-FLGA package formats. In practice, that means the document is likely used to align package-level electrical interface expectations across design, test, and manufacturing teams. It can support technical assessment, interface definition, and documented evaluation during product development, especially where operational consistency and controlled package integration are important to the engineering workflow.

Compliance applications of IEC 62148-21:2021

Organizations may use IEC 62148-21:2021 when preparing package specifications, reviewing interface drawings, or checking whether PIC packaging choices fit internal engineering documentation and quality workflows. It is also relevant for laboratory evaluation and verification activities that compare package designs against expected interface conventions. For procurement and supply-chain review, the document can serve as a compliance reference when assessing whether a component or package definition aligns with the intended technical criteria for integration and validation.

Importance of compliance with IEC 62148-21:2021

Using IEC 62148-21:2021 in design and review processes can help reduce interface-related risk and improve consistency across engineering, testing, and procurement teams. Clear electrical interface guidance supports better technical validation, fewer integration errors, and more predictable conformity assessment preparation. It may also improve traceability in quality assurance activities, especially when multiple stakeholders need a shared basis for approval, testing workflows, and documented compliance decisions for PIC package implementations.

• Design guidance for electrical interfaces in PIC packages using S-FBGA and S-FLGA
• Useful for interface definition, package review, and engineering documentation control
• Supports testing workflows, technical validation, and laboratory evaluation
• Relevant to procurement checks and conformity assessment preparation
• Helps improve consistency in photonic component integration and compliance workflows