IEC 62153-4-3:2013/AMD1:2024
Amendment 1 - Metallic communication cable test methods - Part 4-3: Electromagnetic compatibility (EMC) related test method for measuring surface transfer impedance - Triaxial method
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About This Item
IEC 62153-4-3:2013/AMD1:2024 is a supporting amendment to the parent document IEC 62153-4-3:2013, focused on the triaxial method for measuring surface transfer impedance in metallic communication cable test methods. It is relevant where EMC-related verification is needed for cable performance review, laboratory evaluation, and technical compliance work. For engineers and procurement teams assessing a testing standard, the amendment helps define how the underlying method should be interpreted or updated within documented evaluation and conformity assessment workflows.
Purpose of IEC 62153-4-3:2013/AMD1:2024
The purpose of IEC 62153-4-3:2013/AMD1:2024 is to modify the parent testing method used to assess surface transfer impedance using a triaxial setup. In practical terms, it supports more consistent technical validation of metallic communication cables where EMC behavior is part of the design or acceptance review. Because it is an amendment rather than a standalone technical document, it is used alongside the base reference to keep engineering specification, test interpretation, and compliance reference materials aligned during review and implementation.
Compliance applications of IEC 62153-4-3:2013/AMD1:2024
IEC 62153-4-3:2013/AMD1:2024 is typically relevant in laboratory test programs, product qualification, and documentation checks for metallic communication cables and related components. It may be used by organizations preparing technical files, performing EMC-related verification activities, or updating internal testing workflows after a change to the parent method. For teams involved in conformity assessment, the amendment can support clearer evaluation of measured results, procurement review, and regulatory preparation when triaxial surface transfer impedance data is part of the compliance package.
Benefits of IEC 62153-4-3:2013/AMD1:2024
Using IEC 62153-4-3:2013/AMD1:2024 alongside the parent document can improve testing consistency and reduce interpretation risk in EMC-focused cable assessment. It helps laboratories and engineering teams maintain operational consistency across verification activities, especially where repeatable measurements are needed for quality assurance or product evaluation. For procurement and compliance workflows, the amendment supports more reliable technical review, better conformity assessment preparation, and clearer documentation of how surface transfer impedance testing was applied within the broader compliance process.
- Supporting amendment linked to IEC 62153-4-3:2013 for triaxial surface transfer impedance testing
- Relevant to EMC-related evaluation of metallic communication cables
- Useful for laboratory methods, technical validation, and documented evaluation
- Supports compliance workflows, procurement review, and conformity assessment preparation
- Publication Date: 2024-08-05
- Standard Status: Amendment
- Publisher: IEC
- Edition: 2
- This Version: IEC 62153-4-3:2013 (2024-08-05)
- Previous Version: IEC 62153-4-3:2013 (2013-10-22)
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