IEC 62769-4:2023
Field Device Integration (FDI®) - Part 4: FDI Packages
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About This Item
IEC 62769-4:2023 defines the FDI® Packages part of the Field Device Integration framework, making it relevant for teams that need a reliable technical reference for package structure and handling within device integration workflows. It supports engineering documentation, technical review, and conformity assessment activities where consistent package interpretation matters. For organizations working with field device integration, IEC 62769-4:2023 can help align procurement, verification activities, and validation processes around a shared compliance reference.
Purpose of IEC 62769-4:2023
The purpose of IEC 62769-4:2023 is to describe the FDI Packages aspect of Field Device Integration in a way that supports consistent implementation and evaluation. In practice, it is useful for teams defining how device-related package information is prepared, reviewed, and used across engineering and compliance workflows. The document is relevant when technical documentation must be checked for operational consistency, when integration requirements are being assessed, or when a documented basis is needed for product evaluation and technical validation.
Compliance applications of IEC 62769-4:2023
IEC 62769-4:2023 is commonly used in compliance workflows linked to industrial automation and field device integration projects, especially where packaged device data must support testing, deployment, or system integration. It may be referenced during laboratory evaluation, engineering specification review, or procurement due diligence to confirm that FDI package-related expectations are understood before implementation. For organizations preparing conformity assessment evidence, it can provide a structured technical reference for documentation review and risk management.
Benefits of IEC 62769-4:2023
Using IEC 62769-4:2023 can improve consistency across technical review and quality workflows by giving teams a defined reference for FDI Packages within the broader Field Device Integration environment. This can support interoperability checks, reduce ambiguity during engineering validation, and help teams coordinate testing workflows more effectively. It is also useful for procurement and compliance preparation, where clear document control and traceable technical assessment can lower implementation risk and improve confidence in conformity assessment activities.
- Supports review of FDI package-related documentation within integration projects
- Helps align engineering validation and technical assessment activities
- Useful for procurement, compliance preparation, and conformity assessment planning
- Provides a structured reference for consistency in device integration workflows
- Publication Date: 2023-05-04
- Standard Status: Original
- Publisher: IEC
- Edition: 3
- This Version: IEC 62769-4:2023 (2023-05-04)
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