IEC 62899-301-2:2017

IEC 62899-301-2:2017 addresses Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension, making it relevant for teams that need a defined approach to evaluating pattern dimensions in contact printing equipment. In practical engineering and procurement workflows, IEC 62899-301-2:2017 helps support consistent technical review, documented evaluation, and quality workflows where dimensional accuracy of a rigid master must be understood and compared in a repeatable way.

Purpose of IEC 62899-301-2:2017

The purpose of this technical document is to establish a measurement method for the plate master pattern dimension used in contact printing with a rigid master. Its scope is closely tied to printed electronics equipment and the verification activities needed to assess dimensional characteristics in a controlled way. For laboratories, manufacturers, and conformity assessment teams, it provides a reference point for technical validation, helping reduce ambiguity when comparing results across engineering documentation and test reports.

Compliance applications of IEC 62899-301-2:2017

This reference is useful in compliance workflows where printed electronics equipment must be assessed using documented methods rather than ad hoc measurement practices. It may be applied during product evaluation, prototype verification, supplier review, or laboratory evaluation of contact printing processes that rely on a rigid master. Organizations involved in technical assessment and procurement can use it to align internal testing workflows with a consistent dimensional measurement approach, supporting traceable conformity assessment preparation.

Benefits of IEC 62899-301-2:2017

Using IEC 62899-301-2:2017 can improve consistency in measurement and reduce risk when evaluating pattern dimensions for printed electronics equipment. A shared method supports better comparison between suppliers, test sites, and engineering teams, which is important for operational consistency and quality assurance. It also helps structure compliance reference materials, supports procurement review, and contributes to more reliable technical validation when dimensional performance is part of the acceptance or certification process.

• Measurement method focused on plate master pattern dimension for rigid-master contact printing
• Relevant for printed electronics equipment evaluation and laboratory testing workflows
• Supports documented technical review, conformity assessment, and procurement checks
• Helps improve repeatability and traceability in engineering validation activities