IEC TR 61760-3-1:2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
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About This Item
IEC TR 61760-3-1:2022 addresses surface mounting technology with a specific focus on the specification of components for through hole reflow (THR) soldering, particularly guidelines for through hole diameter design using solder paste surface printing. For engineering teams, it provides a technical reference for aligning component design, PCB layout decisions, and assembly expectations before production release. It is especially relevant where documented evaluation, quality workflows, and technical validation are needed to support reliable soldering outcomes and controlled manufacturing processes.
Overview of IEC TR 61760-3-1:2022
The official title indicates a guidance document for defining through hole diameter design in THR applications when solder paste is applied by surface printing. In practice, IEC TR 61760-3-1:2022 is likely used to support engineering review of board and component interfaces, helping teams establish consistent design assumptions for assembly and verification activities. It can be useful where technical documentation must connect component specification, soldering process intent, and compliance-oriented product evaluation.
Compliance applications of IEC TR 61760-3-1:2022
This technical reference may be applied during PCB design review, component qualification, manufacturing setup, and laboratory evaluation for THR soldering processes. Procurement and compliance teams may also use it when assessing whether component or board specifications are suitably defined for assembly requirements. Because it addresses through hole diameter design and solder paste printing, it is relevant to workflows that require controlled solder joint formation, repeatable process planning, and documented technical assessment before release to production.
Importance of compliance with IEC TR 61760-3-1:2022
Following the guidance in IEC TR 61760-3-1:2022 can support safer and more consistent assembly outcomes by reducing design ambiguity around THR soldering interfaces. Clear specification practices may improve interoperability between component design, PCB fabrication, and soldering processes, while also strengthening testing consistency and engineering validation. For organizations preparing conformity assessment documentation, it can help reduce risk, support procurement decisions, and improve confidence that design intent is translated into manufacturable and verifiable product requirements.
- Guidance for through hole diameter design in THR soldering applications
- Support for solder paste surface printing and assembly planning
- Useful reference for PCB design review and component specification checks
- Helps structure technical validation, quality assurance, and conformity assessment preparation
- Publication Date: 2022-06-17
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC TR 61760-3-1:2022 (2022-06-17)
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