IEC TS 62647-21:2013
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
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About This Item
IEC TS 62647-21:2013 provides guidance for process management in avionics programs where aerospace and defence electronic systems contain lead-free solder. It is relevant when organizations need a structured approach to managing the transition to lead-free electronics while maintaining engineering control, product integrity, and documented evaluation. Based on the title, the document is especially useful for teams that must coordinate technical review, risk management, and compliance workflows across design, procurement, manufacturing, and verification activities.
Purpose of IEC TS 62647-21:2013
The purpose of IEC TS 62647-21:2013 is to support program management and systems engineering decisions during the shift to lead-free electronics in avionics-related applications. It is intended to help organizations align technical assessment, quality workflows, and engineering documentation with the challenges introduced by material and process changes. In practice, it can serve as a compliance reference for planning, review, and control activities where lead-free solder adoption affects conformity assessment, validation planning, and operational consistency.
Compliance applications of IEC TS 62647-21:2013
This technical document is typically used in aerospace and defence engineering environments where electronic assemblies, subsystem integration, and supplier coordination must be managed under lead-free requirements. It may support procurement specifications, internal process qualification, laboratory evaluation, and project-level compliance preparation. Teams involved in technical validation and product evaluation can use it to structure evidence for decision-making, particularly when assessing transition risk, documenting controls, and maintaining traceability through the development and verification lifecycle.
Benefits of IEC TS 62647-21:2013
IEC TS 62647-21:2013 can help reduce uncertainty when lead-free solder is introduced into avionics programs by providing a disciplined framework for engineering oversight. That can improve safety-related decision-making, testing consistency, and technical validation across complex supply chains. For organizations managing conformity assessment or regulatory preparation, it supports clearer documentation, more consistent review criteria, and better coordination between design, testing, and procurement functions. It is also useful where risk reduction and quality assurance are important to maintaining performance and interoperability expectations.
- Program management guidance for lead-free transition in aerospace and defence electronic systems
- Systems engineering support for technical review, verification activities, and documented evaluation
- Practical value for procurement, supplier control, and engineering documentation workflows
- Useful in conformity assessment preparation and quality assurance planning
- Relevant to avionics projects managing risk, traceability, and operational consistency
- Publication Date: 2013-07-26
- Standard Status: Original
- Publisher: IEC
- Edition: 1
- This Version: IEC TS 62647-21:2013 (2013-07-26)
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