IEEE 1101.3-1993
Cooled 10 SU Modules
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- Language: English
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About This Item
1101.3-1993 is a technical standard for cooled 10 SU modules, addressing mechanical and system-level considerations for computing and processing equipment and related components, circuits, devices, and systems. It is intended to help define a consistent basis for module integration where cooling, packaging, and fit must be controlled carefully. For teams working with 10 SU hardware, this standard can support clearer design decisions, procurement, and compatibility checks.
1101.3-1993 overview
This standard focuses on the cooled 10 SU module format and its application in computing and processing environments. In practice, that means it is concerned with how modules are arranged, supported, and accommodated within equipment where thermal management is part of the design. As a specification, 1101.3-1993 helps establish a common reference for dimensions, integration expectations, and related engineering considerations so that modules can be used more consistently across compatible systems.
Typical use cases
1101.3-1993 is most relevant when specifying or evaluating cooled 10 SU modules for computing hardware assemblies and system packaging. It may be used in modular equipment platforms, electronics enclosures, and processing systems where airflow, cooling paths, and physical accommodation matter. The standard can also support engineering teams that need to compare module designs, verify form-factor compatibility, or prepare procurement requirements for hardware built around a 10 SU configuration.
Why this standard matters
Using a clear standard for cooled module formats helps reduce variation in design and integration. 1101.3-1993 can improve consistency during specification, testing, and purchasing by giving stakeholders a shared technical reference. That matters when thermal control and module fit affect reliability, serviceability, and overall system performance. For organizations maintaining or sourcing compatible hardware, the standard can also lower the risk of mismatched components or ambiguous requirements.
- Cooled 10 SU module format
- Computing and processing context
- Thermal and packaging reference
- Compatibility and integration checks
- Inactive standard status
- Publication Date: 1993
- Standard Status: Inactive
- Publisher: IEEE
- Subject: Computing and Processing; Components, Circuits, Devices and Systems
- Official IEEE: Doi link
- This Version: 1101.3 (1993)
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