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SAE AIR1141
1992 Report on Flip Chip and Beam Lead Bonding for Electronic Circuits
Standard by SAE International, 1971-12-01
Available Formats:
Availability: Immediate Download
Language: English
License Type: Single User
Updates: Not Included
About This Item
SKU: c712c9810de0
- Publication Date: 1971-12-01
- Standard Status: latest
- Publisher: SAE International
- Document Type: Aerospace Standard
- Subject: Electronic equipment, , , , , , , ,
- Official SAE: Doi link
- This Version: AIR1141 (1971-12-01)
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