SAE AMS2405D

This specification covers the engineering requirements for electroless deposition of low-phosphorus nickel on various materials and the properties of the deposit. AMS2405D has been reactivated and revised to include the latest requirements on hydrogen embrittlement relief consistent with similar plating specifications. ORDERING INFORMATION: The following information shall be provided to the plating processor by the purchaser. 1) Purchase order shall specify not less than the following: AMS2405D Plating thickness desired Basis metal to be plated Tensile strength or hardness of the basis metal (steel alloys only) Pre-plate stress relief to be performed by plating processor (time and temperature) if different from 3.1.4. Special features, geometry or processing present on parts that require special attention by the processor Hydrogen embrittlement relief to be performed by plating processor if different from 3.3 Post plating bake to be performed by plating processor (to harden plating on substrates capable of high temperature, or to improve adhesion) (See 3.3.3) Quantity of pieces to be plated 2) Parts manufacturing operations such as heat treating, forming, joining and media finishing can affect the condition of the substrate for plating, or if performed after plating, could adversely affect the plated part. The sequencing of these types of operations should be specified by the cognizant engineering organization or purchaser and is not controlled by this specification.