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SAE GEIASTD0005_2B

Standard for Mitigating the Effects of Tin Whiskers in Aerospace, Defense, and High Performance Electronic Systems

Standard by SAE International, 2025-12-02

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  • Language: English
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About This Item

This standard establishes processes for performing and documenting mitigation steps taken to reduce the harmful effects of tin whiskers in electronic systems for ADHP applications. This includes electronic piece parts and mechanical hardware that are used on or in the proximity of electronics. This document identifies the requirements for mitigating the effects of tin whiskers applicable to the requirements of the SAE GEIA-STD-0005-1 Lead-free Control Plan (LFCP). An LFCP documents the specific Pb-free materials and assembly processes the LFCP owner will use to eliminate or mitigate the Pb-free risks to assure customers that their ADHP soldered electronic products will meet the applicable reliability requirements of the customer. This standard may also be used independently of SAE GEIA-STD-0005-1. SAE GEIA-STD-0005-2B was revised to incorporate the knowledge accrued from managing tin whisker risks using lead (Pb)-free materials in aerospace, defense, and high-performance (ADHP) soldered electronic products and to comply with the SAE Five-Year Review policy.
SKU: df76290ea92d

  • Publication Date: 2025-12-02
  • Standard Status: latest
  • Publisher: SAE International
  • Document Type: Aerospace Standard
  • Subject: Electronic control systems, , , , , , , ,
  • Official SAE: Doi link

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