This document is an annex to SAE Technical Report SSB-1 (the latest revision). This document provides reference information and guidance concerning methods used by the semiconductor industry and original equipment manufacturers related to radiation hardness assessments. This document is broken into three primary sections. Section 3 discusses part characterization with focus on selection criteria and acceptance testing. Section 4 discusses design hardening for piece parts with focus on degraded design limits and radiation design margin. The last section, Section 5, of this report is on hardness assurance inspection and test. This section discusses total ionizing dose, displacement damage and single event effects testing in detail. This document defines the guidelines for minimum tasks and methods for piece part radiation hardness assurance for plastic encapsulated microcircuits and semiconductors suitable for potential use in many rugged, military, space, extreme, or other environments. These devices were categorized as commercial off the shelf devices (COTS), plastic encapsulated microcircuit/microelectronic (PEM) and/or plastic encapsulated discrete semiconductor (PEDS). Generally, plastic encapsulated devices lack RHA validation; and as such, this places the RHA performance requirement on the procuring activity. The end user assumes the responsibility for validation of vendor’s RHA performance, including the lot traceability. This document provides the process flow for hardness and risk assessment toward meeting project requirements. This document will review radiation environmental constraints, mission specifications, and their anticipated impact on the microelectronic devices as provided in a project’s bill of material (BOM). A part acceptance is considered on an individual basis when assessed to environmental constraints and mission specifications.