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SAE SSB1D

Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications

Standard by SAE International, 2020-01-14

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Availability: Immediate Download

Language: English

License Type: Single User

Updates: Not Included

SAE SSB1D

SSB1D.pdf

About This Item

This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments. This document is intended to provide guidance for Using Plastic Encapsulated Microcircuits and Semiconductors (PEMs) in Military, Aerospace, and other rugged applications. This document addesses the various qualification and monitoring testing of plastic encapsulated microcircuits and discrete semiconductors suitable for potential use in military and aerospace applications. The users can use this document to evaluate the potential suitability of a PEM product or the manufacturer for its intended application. SSB-1 Rev D has been updated from SSB-1 Rev C to take into account the comments from various CE-12 members. The changes from SSB-1 Rev C to SSB-1 Rev D are shown in Appendix A: (informative) Differences between SSB-1 Rev C and SSB-1 Rev D.
SKU: 38e540b94124

  • Publication Date: 2020-01-14

  • Standard Status: latest

  • Publisher: SAE International

  • Document Type: Aerospace Standard

  • Subject: Failure modes and effects analysis, Manufacturing systems, , , , , , ,

  • Official SAE: Doi link
  • This Version: SSB1D (2020-01-14)
  • Previous Version: SSB1C (2000-08-01)

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