TS EN 60191-6-12

TS EN 60191-6-12 is a mechanical standardization document for surface-mounted semiconductor packages, focused specifically on fine-pitch land grid array (FLGA) designs. It provides a common drawing framework for outline definitions so that package dimensions, reference features, and package variants can be described consistently across manufacturers and engineering drawings.

How FLGA package drawings are organised

FLGA is a package family with terminal pitch of 0.8 mm or less. In this style of package, the terminals are arranged in a grid on the underside, which makes outline accuracy, datum selection, and dimensional consistency especially important. The standard addresses the preparation of outline drawings and the recommended dimensional variations, helping engineers interpret package geometry in a uniform way for design, assembly, and mechanical compatibility work.

Notable technical coverage in this edition

• Provides standard outline drawings, dimensions, and recommended variations for FLGA packages with terminal pitch of 0.8 mm or less.
• The scope has been expanded to include square-type FLGA packages, and the title has been updated accordingly.
• A 0.3 mm ball pitch has been added.
• The datum has been changed from the body datum to the ball datum.
• The combination lists of D, E, MD, and ME have been revised.

From a general engineering perspective, this kind of standard is about mechanical definition rather than electrical circuit performance. For densely populated printed circuit boards, clear and consistent package outlining supports placement setup, footprint alignment, and interoperability of engineering documentation. The standard therefore serves as a shared geometric language for a specialised semiconductor package family.