TS EN 60191-6-20:2010

TS EN 60191-6-20:2010 is a mechanical measurement standard for surface mounted semiconductor device packages, focused on the package dimension methods used when preparing outline drawings for small outline J-lead packages (SOJ). In practical terms, it supports consistent definition of the external geometry of a package so the same package style can be interpreted uniformly in drawings and mechanical documentation.

Why SOJ dimensions matter in package drawings

SOJ packages are surface-mount packages with J-shaped leads that curl underneath the sides of the body. For this package family, body size, lead position and the overall envelope are important for board layout, assembly clearance and dimensional comparison. The scope of this standard is limited to measurement methods for these package dimensions; it does not define the electrical characteristics of the device or the full manufacturing process. Its reference to package outline form E in IEC 60191-4 places the measurements within a common outline-drawing framework.

General technical context for users of the document

In semiconductor packaging, standardized measurement methods help ensure that mechanical data can be compared across suppliers, drawings and design teams. For SOJ packages, a common approach to dimensions such as body length, width, height and lead geometry helps reduce ambiguity in footprint planning and prevents mechanical interference during assembly. This document contributes by specifying how dimensions for small outline J-lead packages are to be measured when preparing outline drawings, which is the basis for reliable package documentation.

• Subject: mechanical standardization for surface-mounted semiconductor packages
• Specific focus: small outline J-lead packages (SOJ)
• Scope: methods for measuring package dimensions
• Reference relationship: outline form E in IEC 60191-4