TS EN 60191-6-6

TS EN 60191-6-6 is a design guide within the rules for preparing outline drawings of surface-mounted semiconductor device packages, focused on fine-pitch land grid array (FLGA) packages. It covers common outline drawings and dimensions for FLGA packages with a terminal pitch of 0.80 mm or less and a square package body outline. In practical terms, it helps present the package geometry in a consistent and comparable way across designs.

Why FLGA dimensional definition matters

An FLGA package uses an array of terminals arranged in a grid on the underside of the semiconductor package. As pitch becomes finer, package density increases, but so do the demands on placement accuracy, board layout, and soldering compatibility. For that reason, outline drawings need to capture not only the external envelope, but also the square body form and the dimensional relationships associated with the terminal pattern. This standard provides a common drawing basis across FLGA structures made from different materials and constructions.

What this document covers

• FLGA packages with terminal pitch less than or equal to 0.80 mm
• Packages with a square body outline
• Common outline drawings for all structure and material types
• A design-guide approach for dimensional representation of surface-mounted semiconductor packages

In broader technical context, mechanical standardization of semiconductor packages supports PCB area planning, mounting compatibility, and consistent engineering communication. As part of the TS EN 60191 family, this section contributes to a shared framework for describing package outlines, helping align drawing practice for the FLGA category.