TS EN 61086-1

TS EN 61086-1 is the foundational part that defines terminology, classification, and general requirements for conformal coatings used on loaded printed wire boards. In practical electronics, these thin insulating films are applied to protect circuitry and components from the environment; the focus of this standard is how such coating materials are identified, grouped, and assessed at a general level.

The technical role of conformal coatings

Conformal coatings are very thin dielectric layers that follow the contours of the populated circuit board. In general technical terms, their purpose is to add protection against moisture, contamination, dust, and other environmental influences, while helping reduce the risk of surface leakage. The framework given here is about what counts as this kind of material, how the material families are classified, and what broad performance expectations apply; it does not replace application-specific evaluation for a particular board or operating environment.

What this part includes and excludes

• Provides definitions and a classification structure for electrical insulating coating materials.
• Sets out general requirements and the established performance levels for the materials.
• Applies to coatings intended for loaded printed wire boards.
• Compatibility between the coating and the printed wire board is evaluated in individual applications; this characteristic is excluded from the standard.
• Surface modifiers are not considered conformal coatings and are excluded from the scope.
• This edition adds a Class 3 material for aerospace applications and introduces a new resin type, an oligomeric blend material.

From a general engineering perspective, classification helps separate materials by chemistry, intended use, or performance level so designers, manufacturers, and users can speak the same language. Even so, a standard of this kind does not by itself guarantee suitability for every application; in electronics, actual operating temperature, humidity, mechanical stress, and process compatibility must still be considered separately.