TS EN 62047-22

TS EN 62047-22 is a standard for an electromechanical tensile test method used to evaluate conductive thin films on flexible substrates in the micro-electromechanical systems field. Its technical focus is the way electrical response changes as the film-substrate assembly is mechanically strained, which is a central issue for flexible MEMS and related devices.

In general technical terms, conductive thin films used in flexible electronics and MEMS are not judged by mechanical strength alone. Their resistance or electrical behaviour may vary under stretch, bend, and repeated deformation, and the bonded substrate can strongly influence the measured response. Compared with freestanding films, supported films experience interfacial constraints, adhesion effects, and substrate-driven strain transfer, so tensile testing is used to observe the coupled mechanical and electrical behaviour in a controlled way.

According to the scope, this part of IEC 62047 applies to conductive thin micro-electromechanical materials bonded on non-conductive flexible substrates. The scope also notes that the relative thickness and size relationship between the thin film and the flexible substrate can affect test results, meaning specimen geometry, loading conditions, and interface quality are important to interpretation. In practice, the document provides a common test framework for a very specific class of layered specimens rather than for generic thin films in free-standing form.

• The film and the flexible substrate are assessed as an assembly, not as an isolated film.
• The method is intended to measure electromechanical properties under tensile loading.
• Interfacial interaction and adhesion can influence the measured outcome.
• Typical application areas include MEMS, consumer products, and flexible electronics.
• The standard targets supported conductive thin films rather than free-standing films.