IEC 60191-2X:1999/COR1:2000 is a corrigendum to Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions, providing a supporting correction to the parent reference IEC 60191-2X:1999. For teams working with semiconductor device packages, drawings, or dimensional verification, it helps ensure that engineering documentation and compliance checks are aligned with the corrected text. In procurement, testing, and technical review workflows, IEC 60191-2X:1999/COR1:2000 is used as a focused compliance reference rather than a standalone technical specification.

What is IEC 60191-2X:1999/COR1:2000?

This document is a corrigendum connected to the mechanical standardization of semiconductor devices, specifically the dimensional requirements covered in Part 2. Its role is to amend or clarify the parent document so that dimensional references used in design, verification activities, and manufacturing documentation remain consistent. For organizations preparing technical documentation or carrying out documented evaluation, the corrigendum supports accurate interpretation of the mechanical dimensions that may affect device fit, assembly, and conformity assessment.

Applications of IEC 60191-2X:1999/COR1:2000

IEC 60191-2X:1999/COR1:2000 is relevant in semiconductor component engineering, package drawing review, supplier quality workflows, and laboratory evaluation of dimensional compliance. It may be consulted during product evaluation, incoming inspection, or when validating that device dimensions match the corrected mechanical references in the parent publication. Technical teams often use such a document when preparing engineering documentation, comparing supplier data sheets, or supporting operational consistency across design and manufacturing processes.

Why is IEC 60191-2X:1999/COR1:2000 important?

Corrective documents such as this one help reduce risk in conformity assessment by keeping technical references accurate and consistent. For semiconductor devices, even small dimensional errors can affect interoperability, assembly reliability, and quality assurance outcomes. Using IEC 60191-2X:1999/COR1:2000 in compliance workflows supports better technical validation, clearer procurement review, and more reliable verification of device dimensions against the parent standard. It is especially useful when organizations need a defensible basis for engineering review or regulatory preparation.

• Supporting corrigendum for the parent document IEC 60191-2X:1999
• Focused on corrected mechanical dimensions for semiconductor devices
• Useful in technical review, inspection, and conformity assessment workflows
• Helps maintain consistency in engineering documentation and supplier specifications