IEC 60191-6-2:2001/COR1:2002 is a corrigendum to the mechanical standardization document for semiconductor device package outline drawings, focused on the design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. As a supporting reference to the parent publication, it is relevant when teams need accurate package geometry information for engineering documentation, procurement review, and conformity assessment. For organizations working on package definition, technical validation, or documented evaluation, IEC 60191-6-2:2001/COR1:2002 helps maintain consistency in how outline drawings are interpreted and applied.

Overview of IEC 60191-6-2:2001/COR1:2002

This corrigendum is tied to IEC 60191-6-2:2001 and serves as a modifying reference rather than a standalone technical specification. Its role is to support the preparation and use of outline drawings for surface mounted semiconductor device packages with ball and column terminals at the listed pitch dimensions. In practical terms, it is relevant to engineering documentation, drawing control, and technical review workflows where package outline accuracy affects downstream design decisions, supplier coordination, and compliance preparation.

Compliance applications of IEC 60191-6-2:2001/COR1:2002

Organizations may use IEC 60191-6-2:2001/COR1:2002 during product evaluation, supplier document checks, and internal quality workflows involving semiconductor packaging data. It can support technical assessment of package outlines before PCB layout release, incoming documentation review, or conformity assessment preparation for components used in electronics assemblies. Because it is a corrigendum, it is most useful when teams need to confirm that the parent document is applied with the correct corrections in place, reducing ambiguity in testing workflows and operational consistency.

Importance of compliance with IEC 60191-6-2:2001/COR1:2002

Using the corrected reference can improve engineering consistency and reduce the risk of design or procurement errors caused by outdated package information. In semiconductor and electronics workflows, even small outline discrepancies may affect fit, assembly planning, or verification activities. Aligning documentation with IEC 60191-6-2:2001/COR1:2002 supports quality assurance, technical validation, and more reliable cross-functional communication between design, testing, and purchasing teams. It also helps strengthen conformity assessment preparation by keeping the supporting technical document aligned with the parent publication.

• Corrective reference connected to the parent package outline drawing guidance
• Relevant to surface mounted semiconductor devices with ball and column terminal packages
• Useful for drawing control, technical review, and document management processes
• Supports consistent interpretation of package geometry in engineering and procurement workflows
• Helps maintain traceability in compliance, verification, and quality assurance activities