IEC 60191-6-2:2001 provides technical guidance for the preparation of outline drawings for surface mounted semiconductor device packages, with a specific focus on 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. For engineering, procurement, and compliance teams, it helps create a common reference for package documentation, dimensional communication, and review of device outlines. IEC 60191-6-2:2001 is relevant where consistent package definition supports technical assessment, documented evaluation, and smoother collaboration between device suppliers and downstream users.

What is IEC 60191-6-2:2001?

This document is part of the mechanical standardization series for semiconductor devices and concentrates on general rules for outline drawings of surface mounted packages. Its purpose is to guide how package geometry is represented so that drawings can be used reliably in design, verification activities, and procurement checks. By addressing ball and column terminal packages at the stated pitches, IEC 60191-6-2:2001 supports clearer engineering documentation and reduces ambiguity when teams compare package data across suppliers or internal specifications.

Applications of IEC 60191-6-2:2001

The reference is typically used in semiconductor packaging design, component qualification, and parts selection workflows where package outlines must be interpreted consistently. It may support PCB footprint planning, supplier documentation review, and laboratory evaluation of package dimensions against expected mechanical definitions. In quality workflows, IEC 60191-6-2:2001 can also assist with conformity assessment preparation and technical validation when organizations need a dependable compliance reference for surface mounted semiconductor device packages.

Why is IEC 60191-6-2:2001 important?

Clear outline drawing rules help reduce interpretation errors that can affect fit, assembly, and downstream product evaluation. For teams managing technical review, the document supports more consistent comparison of device packages, which is useful for procurement decisions, engineering validation, and risk management. It can also improve testing workflows by providing a stable basis for dimensional checks and technical compliance assessments, especially when multiple suppliers or design variants must be reviewed against the same mechanical criteria.

• Guidance for outline drawings of surface mounted semiconductor device packages
• Relevant to 1,50 mm, 1,27 mm, and 1,00 mm pitch ball and column terminal packages
• Useful for design review, footprint coordination, and dimensional documentation
• Supports procurement checks, conformity assessment, and technical validation workflows